Xiaoling He - Assistant Professor



Contact Information

Office Address:
EMS E371F
3200 North Cramer Street
Milwaukee, WI 53211
Phone: 414-229-6772
Fax: 414-229-6958
Email: xiaoling@uwm.edu

Mailing Address:
P.O. Box 784
Department of Mechanical Engineering
University of Wisconsin-Milwaukee
Milwaukee, WI 53201

Education

Ph.D. - Mechanical Engineering, Georgia Institute of Technology, Atlanta, GA, 2000
M.S. - Mechanical Engineering in Tribology, Georgia Institute of Technology, Atlanta, GA, 2000
M.S. - Mechanical Engineering, University of Tennessee, Knoxville, TN, 1997

Research Experience

Dec. 2000~Jan. 2002, Member of Technical Staff, Bell Labs, Lucent Technology
Thin film and material study for advanced semiconductor interconnect.
Jan. 2002~Aug.2002, Post-doctoral Research Associate, Physical Chemistry, Case Western Reserve University, Cleveland OH.
Synthesis of nanostructures, Carbon Nanotube, NMEM research and development.

Research Interests

Nonlinear dynamics and chaos in microstructures.
Semiconductor thin films and surface analysis and Tribology.
Hybrid electric vehicle modeling and simulation, battery modeling.

Selected Publications
  • X. He, R. Fulton (2002). Nonlinear Dynamic Analysis of a Printed Wiring Board, Transaction of ASME, J. Electronic Packaging, 124(2), pp77-84.
  • X. He, M. Stallybrass (2002). Drop-induced Impact Response of a Printed Wiring Board, International Journal of Solids and Structures, 39(24), pp.5979-5990.
  • X. He, R. Fulton (2002). PWB Stability Analysis under In-plane Forces, Electronic Component Technology Conference, pp467-472, San Diego.
  • X. He, R. Fulton (2001). Reliability Analysis on the Chaos Induced by the Transient Temperature Variation of a Printed Wiring Board, Symposium on Electronic & Photonics Packaging, IMECE-2001/EEP-24733, New York.
  • X. He (2000). Nonlinear Dynamics Analysis of a Printed Wiring Board with Simple and Clamped Boundary Conditions, IMECE/DE-23213-2001, New York.
  • X. He, C. Burda (2002). Thermal Stress Induced Void Formation in Semiconductor Interconnect. IMECE 2002-34513, New Orlean, LA.
  • X. He, J. Hodgson, (2002). Modeling and Simulation on Hybrid Electric Vehicles, Part-I: Modeling, IEEE Transactions on Intelligent Transportation Systems, 3(4), 235-243.
  • X. He, J. Hodgson, (2002). Modeling and Simulation on Hybrid Electric Vehicles, Part-II: Simulation, IEEE Transactions on Intelligent Transportation Systems, 3(4), 244 - 251.
  • X. He, (2001). A Method for Battery Modeling In Hybrid Electric Vehicle Simulation and Evaluation, SAE 2001-01-0960, SAE World Congress, March 2001, Detroit.
  • X. He, J. Hodgson, (2000). Hybrid Electric Vehicle Simulation and Evaluation for UT-HEV, SAE 2001-01-3105(SP-1560), Presented at the Future Transportation Conference, August 2000, Costa Mesa, CA.