AI3 Capabilities

  • Infrastructure that spans the product development cycle from concept to functional prototype
  • World-class CAE capabilities (CAD, FEA, and Sumulation)
  • Rapid Prototyping (Fused Deposition and Powder Deposition)
  • Reverse Engineering (Contact and CCD Scanners)
  • Rapid Manufacturing (Vacuum Casting, CNC Machining, Injection Molding, Electronics - PCB, Microchip Programming, Analog, Digital & Mixed Signal Circuit Design)
  • Advanced Characterization and Testing (Instron, hardness, electronics, SEM, TEM)
  • Structural Engineering Testing Lab (Universal Test Machines - MTS/T&O/Hydraulic, NDE, Strong Floor/Walls/Test Frames, Large & Small Capacity and Size)